LTM - Laboratoire des Technologies de la Micro-�lectronique

Journ�es scientifiques 2008

Corinne Perret — 2008-10-16T12:23:17Z

Introduction g�n�rale
Olivier JOUBERT
Bilan 2007-2008 et perspectives 2008-2009
Pr�sentations � Gravure Plasma �
Introduction par Laurent VALLIER
Axes d'�tudes, moyens humains et contractuels, collaborations et perspectives
Erwin PARGON
Activit� plasma-r�sine
Kevin MENGUELTI
Impact des plasmas de Cure sur les r�sines 193 nm
Mickael MARTIN
Impact des proc�d�s plasmas sur le LWR des r�sines 193 nm
David VEMPAIRE
UV LEDs in BBUV absorption spectroscopy
Laurene BABAUD
D�veloppement et optimisation d'un (...)

High K dielectric materials

Corinne Perret — 2008-01-22T16:16:43Z

DIELECTRICS IN MICROELECTRONICS
Responsible : C. Vall�e, MdC UJF (christophe.vall�e@cea.fr)
Actors : M. Bonvalot, MdC UJF P. Gonon, MdC UJF, M. Kahn, PhD
This activity focuses on the study of high-dielectric constant ("high-k") materials for Metal-Insulator-Metal (MIM) capacitors. Metal-Insulator-Metal (MIM) capacitors are components which are found in many integrated circuits where they are used for decoupling, filtering, analog-to-digital conversion, and other RF functions. Up to now SiO2 and (...)

Faits marquants 2007

Corinne Perret — 2008-01-22T14:58:08Z

T�l�charger le pdf des faits marquants du LTM en 2007

Faits marquans 2007

Corinne Perret — 2008-01-22T14:54:53Z

T�l�charger le pdf des faits marquants du LTM en 2007

Journ�es scientifiques 2007

Corinne Perret — 2007-10-23T09:33:59Z

Les journ�es scientiques du LTPM se sont d�roul�es les 17 et 18 septembre 2007. Vous pouvez consulter les contributions pr�sent�es lors de ces journ�es.

journ�es scientifiques 2007

Corinne Perret — 2007-10-23T09:30:48Z

Les journ�es scientifiques 2007 du LTM se sont d�roul�es les 17 et 18 septembre 2007. Voici certaines des contributions pr�sent�es pendant ces 2 journ�es :
Programme g�n�ral des journ�es Lithographie
P. Schiavone : Pr�sentation de l'�quipe Lithographie
S. Soulan : Scat�rometrie en temps r�el
Jean-Herv� Tortai : les techniques de caract�risation des r�sines de lithographie
Hassan Ridaoui : Caract�risation des r�sines polym�res pour la litho 193 nm
Marc Zelsmann : Mat�riaux front end et back end pour la lithographie UV-NIL (...)

Open positions at LTM

Corinne Perret — 2007-10-23T08:36:25Z

New post doc positions and traning courses are available from now at LTM.
See Details here

LAM Research etch platform

Corinne Perret — 2007-06-05T12:19:15Z

LAM Research etch platform equipped with one 200 mm poly chamber. As shown in Fig.1 this tool is dedicated to the etch work made on non-conventional substrate i.e. samples with non Si related materials. For the last years, the tool was involved in the development of optical absorption diagnostics, in the nano-imprint project and in diblock-polymer patterns transfer.
More recently, our group has entered the 300 mm wafer size world. An Applied Materials tool is equipped with two etching (...)

Applied Materials etch platform

Corinne Perret — 2007-06-05T12:13:09Z

Applied Materials etch platform equipped with three 200 mm plasma chambers : poly chamber (DPS), metal chamber (DPS+), dielectric chamber (eMax). The platform is connected to a customized XPS analysis chamber thus allowing vacuum transfer of the processed wafer for further surface analysis. See Fig. 1
Fig. 2 shows the customized XPS chamber configuration that allows analysing full 200 mm wafers.
Each chamber was modified to implement diagnostics such as mass spectrometry, Laser or (...)

Publications

Corinne Perret — 2007-06-05T09:35:17Z

Articles
2007
Etch mechanisms of hybrid low-k material (SiOCH with porogen) in fluorocarbon based plasma
D. Eon, M. Darnon, T. Chevolleau, T. David, L. Vallier, O. Joubert
J. Vac. Sci. Technol.B, in press (2007)
Analyses of chamber walls coatings during the patterning of ultra low-k materials with a metal hard mask : consequences on cleaning strategies
T. Chevolleau, M. Darnon, T. David, N. Posseme, J. Torres and O. Joubert
J. Vac. Sci. Technol.B, in press (2007)
2006
Etching (...)